Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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10/31/2006
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Application #:
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10994604
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Filing Dt:
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11/22/2004
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Inventors:
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Charles W.C. Lin, Cheng-Lien Chiang
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH BUMPED METAL PILLAR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 2440 ANDREW DRIVE |
| SUPERIOR, COLORADO 80027 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT, TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 487 BLACKFOOT STREET |
| SUPERIOR, CO 80027 |
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Assignment:
3
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| 333 SOUTH HOPE STREET, 13TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| CT LIEN SOLUTIONS |
| 187 WOLF ROAD, SUITE 101 |
| ALBANY, NY 12205 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 12380 CLARK STREET |
| SANTA FE SPRINGS, CALIFORNIA 90670 |
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| 12045 34TH STREET |
| ST. PETERSBURG, FLORIDA 33716 |
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| LATIFFANY BROWN C/O KATTEN MUCHIN ROSENM |
| 525 WEST MONROE STREET |
| CHICAGO, IL 60661 |
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