Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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10643043
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Filing Dt:
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08/18/2003
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Publication #:
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Pub Dt:
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02/24/2005
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Inventors:
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Scott D. Brandenburg, Bruce A. Myers
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Title:
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ELECTRONIC ASSEMBLY WITH SOLDER-BONDED HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 5052 |
| LEGAL STAFF - MAIL CODE: 480-410-202 |
| TROY, MICHIGAN |
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| DELPHI TECHNOLOGIES, INC. |
| STEFAN V. CHMIELEWSKI |
| P.O. BOX 9005 |
| LEGAL STAF MC CT10C |
| KOKOMO, IN 46904-9005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERIN COURT, BISHOP'S COURT HILL |
| ST. MICHAEL, BARBADOS |
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| DELPHI TECHNOLOGIES IP LIMITED |
| 5825 INNOVATION DRIVE |
| LEGAL STAFF - M/C 480-415-154 |
| TROY, MI 48098 |
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