Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/20/2007
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Application #:
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10754807
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Filing Dt:
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01/08/2004
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Inventor:
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Garnik Taheri
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Title:
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SINGLE IC PACKAGING SOLUTION FOR MULTI CHIP MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4211 STARBOARD DRIVE |
| FREMONT, CALIFORNIA 94538 |
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| THELEN REID & PRIEST LLP |
| THIERRY K. LO |
| P.O. BOX 640640 |
| SAN JOSE, CA 95164 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4211 STARBOARD DRIVE |
| FREMONT, CALIFORNIA 94538 |
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| THELEN REID & PRIEST LLP |
| THIERRY K. LO |
| P.O. BOX 640640 |
| SAN JOSE, CA 95164 |
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Assignment:
3
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COLLATERAL ASSIGNMENT OF PATENTS (SECURITY AGREEMENT)
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| 60 LIVINGSTON AVENUE |
| ST. PAUL, MINNESOTA 55107 |
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| THOMSON & THOMSON |
| 1750 K STREET, NW |
| SUITE 200 |
| WASHINGTON, DC 20006 |
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Assignment:
4
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RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME (015829/0808)
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| 39870 EUREKA DRIVE |
| NEWARK, CALIFORNIA 94560 |
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| PARIJAT SHARMA |
| 2550 HANOVER STREET |
| PALO ALTO, CA 94304 |
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