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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/06/2007
Application #:
10903680
Filing Dt:
07/29/2004
Inventors:
Tan Eng Hwa, Lim Peng Soon, Santhiran S/O Nadarajah, Ong Sze Yan
Title:
STRESS RELIEVING FILM FOR SEMICONDUCTOR PACKAGES
Assignment: 1
Reel/Frame:
015647/0562Recorded: 07/29/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/19/2004
Exec Dt:
07/21/2004
Exec Dt:
07/19/2004
Exec Dt:
07/19/2004
Assignee:
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA 95051-8090
Correspondent:
BEYER WEAVER & THOMAS LLP
P.O. BOX 70250
BERKELEY, CA 94704-0778
Assignment: 2
Reel/Frame:
016096/0418Recorded: 04/18/2005Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/19/2004
Exec Dt:
07/21/2004
Exec Dt:
07/19/2004
Exec Dt:
07/19/2004
Assignee:
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA 95051-8090
Correspondent:
BEYER WEAVER & THOMAS LLP
P.O. BOX 70250
OAKLAND, CA 94612-0250

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