Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/20/2007
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Application #:
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10512711
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Filing Dt:
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10/27/2004
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Publication #:
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Pub Dt:
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09/29/2005
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Inventors:
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Jun Wei, Zhiping Wang, Hong Xie
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Title:
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METHOD OF WAFER/SUBSTRATE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 BIOPOLIS WAY #07-01 CENTROS |
| SINGAPORE, SINGAPORE 138668 |
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| OSTROLENK FABER GERB, ET AL. |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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