Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/08/2007
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Application #:
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11067300
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Filing Dt:
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02/25/2005
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Publication #:
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Pub Dt:
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12/29/2005
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Inventors:
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Richard Yee Lum, Wong Chee Heng, Lau Kam Chuan, Goh Kok Siang, Yip Chee Sang
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Title:
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METHOD FOR ENCAPSULATING LEAD FRAME PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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S-SITE, LOT 52986 |
TAMAN MERU INDUSTRIAL ESTATE, JELAPANG |
IPOH, PERAK DARUL RIDZUAN, MALAYSIA 30720 |
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WILLIAM L. SHAFFER |
TOWNSEND AND TOWNSEND AND CREW LLP |
TWO EMBARCADERO CENTER |
EIGHTH FLOOR |
SAN FRANCISCO, CALIFORNIA 94111-3834 |
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