Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/22/2007
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Application #:
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11116349
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Filing Dt:
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04/28/2005
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Publication #:
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Pub Dt:
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11/02/2006
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Inventor:
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Shu-Jeng Yeh
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Title:
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DEVICE FOR CARRYING THIN WAFERS AND METHOD OF CARRYING THE THIN WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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69 TECHNOLOGY 7 RD. HWAYA TECHNOLOGY PARK |
KUEI SHAN HSIANG |
TAO YUAN SHIEN, TAIWAN R.O.C. |
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DENNISON, SCHULTZ, DOUGHERTY & MACDONALD |
1727 KING STREET |
SUITE 105 |
ALEXANDRIA, VA 22314 |
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