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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/03/2007
Application #:
10877687
Filing Dt:
06/25/2004
Publication #:
Pub Dt:
02/03/2005
Inventor:
Adrian E. Ong
Title:
MULTIPLE POWER LEVELS FOR A CHIP WITHIN A MULTI-CHIP SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
015524/0369Recorded: 06/25/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/23/2004
Assignee:
2290 NORTH FIRST STREET, SUITE 201
SAN JOSE, CALIFORNIA 95131
Correspondent:
SIDLEY AUSTIN BROWN & WOOD LLP
PHILIP W. WOO
555 CALIFORNIA STREET, SUITE 5000
SAN FRANCISCO, CALIFORNIA 94104
Assignment: 2
Reel/Frame:
022597/0896Recorded: 04/28/2009Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/27/2009
Assignee:
4440 EL CAMINO REAL
LOS ALTOS, CALIFORNIA 94022
Correspondent:
SHUN YAO
PARK, VAUGHAN & FLEMING, LLP
2820 FIFTH STREET
DAVIS, CA 95618

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