Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/24/2007
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Application #:
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10542211
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Filing Dt:
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03/16/2006
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Publication #:
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Pub Dt:
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10/19/2006
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PCT #:
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US0403170
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Inventors:
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Frank J. Juskey, Daniel K. Lau
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Title:
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THIN MULTIPLE SEMICONDUCTOR DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2215-B RENAISSANCE DRIVE |
| LAS VEGAS, NEVADA 89119 |
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| BERKELEY LAW & TECHNOLOGY GROUP, LLC |
| 1700 NW 167TH PLACE, SUITE 240 |
| BEAVERTON, OREGON 97006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| C/O VALMET (MAURITIUS) LIMITED |
| 608 ST. JAMES COURT, DENIS STREET |
| PORT LOUIS, MAURITIUS |
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| GREGORY S. ROSENBLATT |
| 265 CHURCH STREET |
| NEW HAVEN, CT 06510 |
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