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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7253504
Issue Dt:
08/07/2007
Application #:
11010784
Filing Dt:
12/13/2004
Inventors:
Jun Zhai, Jinsu Kwon, Richard C. Blish II
Title:
INTEGRATED CIRCUIT PACKAGE AND METHOD
Assignment: 1
Reel/Frame:
016086/0228Recorded: 12/13/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHAI, JUN
Exec Dt:
09/16/2004
KWON, JINSU
Exec Dt:
09/17/2004
BLISH, II, RICHARD C.
Exec Dt:
09/16/2004
Assignee:
ADVANCED MICRO DEVICES, INC.
1160 KERN AVENUE
SUNNYVALE, CALIFORNIA 94086-3453
Correspondent:
MARCUS W. SPROW
FOLEY & LARDNER LLP
777 EAST WISCONSIN AVENUE
MILWAUKEE, WI 53202-5306
Assignment: 2
Reel/Frame:
016225/0512Recorded: 07/06/2005Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS ON AN ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 016086 FRAME 0228. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
Assignors:
ZHAI, JUN
Exec Dt:
09/16/2004
KWON, JINSU
Exec Dt:
09/17/2004
BLISH, II, RICHARD C.
Exec Dt:
09/16/2004
Assignee:
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE
P.O. BOX 3453
SUNNYVALE, CALIFORNIA 94086-3453
Correspondent:
MARCUS W. SPROW
777 EAST WISCONSIN AVENUE
FOLEY & LARDNER LLP
MILWAUKEE, WI 53202-5306

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