Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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11164971
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Filing Dt:
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12/13/2005
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Publication #:
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Pub Dt:
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10/12/2006
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Inventors:
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Cheng-Wei Huang, Kuang-Wei Yao
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Title:
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CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7 FLOOR-1, NO. 100 |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI, TAIWAN 100 |
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