Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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10459400
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Filing Dt:
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06/10/2003
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Publication #:
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Pub Dt:
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01/22/2004
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Inventors:
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Heung-Kyu Kwon, Tae-Je Cho, Min-Ha Kim
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Title:
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HIGH-POWER BALL GRID ARRAY PACKAGE, HEAT SPREADER USED IN THE BGA PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-GU, SUWON-CITY |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
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