Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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10104826
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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08/01/2002
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Inventors:
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Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi et al
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Title:
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SEMICONDUCTOR DEVICE WITH LEAD-FREE SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 272400 |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, COLORADO 80527-2400 |
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| HEWLETT-PACKARD COMPANY |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| P.O. BOX 272400 |
| FORT COLLINS, COLORADO 80527-2400 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME CHIYODA-KU |
| TOKYO,, JAPAN |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| ROBERT C. COLWELL |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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Assignment:
3
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MERGER AND CHANGE OF NAME
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| ROGER HYLTON |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| KILPATRICK TOWNSEND & STOCKTON LLP |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
4
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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