Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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10687713
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Filing Dt:
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10/17/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Inventors:
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Kuei-Wu Huang, Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Wen-Kai Wan, Cheng-Chung Lin et al
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Title:
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SURFACE TREATED LOW-K DIELECTRIC AS DIFFUSION BARRIER FOR COPPER METALLIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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| DUANE MORRIS LLP |
| WILLIAM H. MURRAY, ESQ. |
| ONE LIBERTY PLACE |
| PHILADELPHIA, PA 19103 |
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