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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/18/2007
Application #:
10874697
Filing Dt:
06/22/2004
Publication #:
Pub Dt:
04/07/2005
Inventors:
Martin Kee, Michael S. Clarke, Rod G. Fleck, Chao-Chi Chen, Craig W. O'Connell et al
Title:
PROCESSOR MODULE PACKAGING FOR A PORTABLE ELECTRONIC DEVICE DISPLAY
Assignment: 1
Reel/Frame:
015758/0053Recorded: 09/07/2004Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2004
Exec Dt:
08/30/2004
Exec Dt:
08/27/2004
Exec Dt:
08/30/2004
Exec Dt:
08/30/2004
Exec Dt:
08/30/2004
Assignee:
505 FIFTH AVEUNE SOUTH
SUITE 900
SEATTLE, WASHINGTON 98104
Correspondent:
DORSEY & WHITNEY LLP
KIMTON N. ENG
1420 FIFTH AVENUE
SUITE 3400
SEATTLE, WA 98101

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