Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/25/2007
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Application #:
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10196305
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Filing Dt:
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07/16/2002
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Publication #:
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Pub Dt:
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12/18/2003
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Inventors:
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Chi-Chuan Wu, Chien-Ping Huang, Han-Ping Pu
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Title:
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FLIP-CHIP SEMICONDUCTOR PACKAGE WITH LEAD FRAME AS CHIP CARRIER AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG RD. |
TANTZU, TAICHUNG, TAIWAN R.O.C |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MASSACHUSETTS 02209 |
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