Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/16/2007
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Application #:
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10533288
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Filing Dt:
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11/03/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Inventors:
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Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima, Toshihiko Taguchi et al
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Title:
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LEAD-FREE SOLDER AND SOLDERED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23 SENJU-HASHIDO-CHO |
ADACHI-KU, TOKYO 120-8555, JAPAN |
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1006, OAZA KADOMA |
KADOMA-SHI, OSAKA 571-8501, JAPAN |
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MICHAEL TOBIAS |
#40 |
1717 K ST. NW, SUITE 613 |
WASHINGTON, DC 20036 |
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