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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/23/2007
Application #:
11074796
Filing Dt:
03/09/2005
Publication #:
Pub Dt:
09/14/2006
Inventors:
Kuo Chung Yee, Chun Chi Lee
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
016411/0180Recorded: 03/09/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2004
Exec Dt:
10/05/2004
Assignee:
26, CHIN 3RD RD.
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN R.O.C.
Correspondent:
STANLEY P. FISHER
REED SMITH LLP
3110 FAIRVIEW PARK DRIVE, SUITE 1400
FALLS CHURCH, VIRGINIA 22042

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