Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2007
|
Application #:
|
10837015
|
Filing Dt:
|
04/30/2004
|
|
Inventors:
|
Michael Richard Ehlert, William Jeffrey Schaefer
|
|
Title:
|
MATERIALS AND STRUCTURE FOR A HIGH RELIABILITY BGA CONNECTION BETWEEN LTCC AND PB BOARDS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051-8090 |
|
|
|
|
| BEYER WEAVER & THOMAS, LLP |
| DESMUND GEAN |
| P.O. BOX 778 |
| BERKELEY, CALIFORNIA 94704-0778 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051-8090 |
|
|
|
|
| BEYER WEAVER LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
|
|
Search Results as of:
06/21/2024 05:19 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
