Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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11345957
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Filing Dt:
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02/02/2006
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Publication #:
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Pub Dt:
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08/02/2007
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Inventors:
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Ali Heydari Monfarad, Ji L. Yang
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Title:
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DIRECT CONTACT COOLING LIQUID EMBEDDED PACKAGE FOR A CENTRAL PROCESSOR UNIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4150 NETWORK CIRCLE |
SANTA CLARA, CALIFORNIA 95054 |
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WILLIAM J. KUBIDA |
HOGAN & HARTSON LLP |
ONE TABOR CENTER |
1200 17TH STREET, SUITE 1500 |
DENVER, CO 80202 |
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Assignment:
2
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MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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Newly Merged Entity's New Name:
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500 ORACLE PARKWAY |
REDWOOD SHORES, CALIFORNIA 94065 |
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ORACLE CORPORATION |
500 ORACLE PARKWAY |
ATTN: PTO GROUP (M/S 5OP7) |
REDWOOD CITY, CA 94065 |
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