Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2007
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Application #:
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11147918
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Filing Dt:
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06/08/2005
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Publication #:
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Pub Dt:
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12/29/2005
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Inventors:
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Yao-Ting Huang, Chih-Huang Chang
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Title:
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LEADFRAME OF A LEADLESS FLIP-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 JINGSAN RD. |
| NANTZ CHIU, KAOHSIUNG, TAIWAN 811 R.O.C. |
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| DANIEL R. MCCLURE |
| THOMAS, KAYDEN, HORSTEMEYER ET AL. |
| 100 GALLERIA PARKWAY |
| SUITE 1750 |
| ATLANTA, GEORGIA 30339 |
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