Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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11279344
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Filing Dt:
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04/11/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Inventor:
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Tae-Sung YOON
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Title:
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SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNOSN & MCCOLLOM, P.C. |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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