Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2008
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Application #:
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11290743
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Filing Dt:
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11/30/2005
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Publication #:
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Pub Dt:
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05/31/2007
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Inventors:
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Richard A. Hoffman, Murray J. Bordeaux, William R. Sessoms, Rodney L. Thompson et al
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Title:
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BUNDLING SYSTEM WITH IMPROVED LOCKING TIE HEAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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724 YORKLYN ROAD, SUITE 280 |
HOCKESSIN, DELAWARE 19707 |
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BRIAN A. GOMEZ |
1501 N. RODNEY STREET, SUITE 101 |
WILMINGTON, DE 19806 |
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