Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2008
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Application #:
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11157862
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Filing Dt:
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06/22/2005
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Publication #:
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Pub Dt:
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01/26/2006
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Inventors:
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Takashi Onishi, Tatsuya Yasunaga, Hideo Fujii, Tetsuya Yoshikawa, Jun Munemasa
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Title:
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METHOD FOR FABRICATING COPPER-BASED INTERCONNECTIONS FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10-26, WAKINOHAMA-CHO 2-CHOME, CHUO-KU |
KOBE-SHI, HYOGO 651-8585, JAPAN |
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OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT |
1940 DUKE STREET |
ALEXANDRIA, VA 22314 |
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