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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/04/2008
Application #:
10690084
Filing Dt:
10/20/2003
Inventors:
Daniel A. Koos, Steven T. Mayer, Heung L. Park, Timothy Patrick Cleary et al
Title:
METHOD FOR FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURE WITH REDUCED CAPACITANCE, LEAKAGE CURRENT, AND IMPROVED BREAKDOWN VOLTAGE
Assignment: 1
Reel/Frame:
014636/0503Recorded: 10/20/2003Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/06/2003
Exec Dt:
10/07/2003
Exec Dt:
10/13/2003
Exec Dt:
10/06/2003
Exec Dt:
10/06/2003
Assignee:
3970 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95134
Correspondent:
BEYER WEAVER & THOMAS, LLP
JEFFREY K. WEAVER
P.O. BOX 778
BERKELEY, CA 94704-0778

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