Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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10923454
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Filing Dt:
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08/20/2004
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Publication #:
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Pub Dt:
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08/25/2005
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Inventors:
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Jeung-Il Kim, Se-hoon Cho
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Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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28 SUNGJU-DONG, CHANGWON-CITY |
KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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ST. ONGE STEWARD JOHNSTON & REENS LLC |
WESLEY W. WHITMEYER, JR. |
ATTORNEY FOR APPLICANTS |
986 BEDFORD STREET |
STAMFORD, CT 06905-5619 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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84, JEONGDONG-RO, SEONGSAN-GU, |
GYEONGSANGNAM-DO, |
CHANGWON-SI, KOREA, REPUBLIC OF 641-120 |
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SUGHRUE MION |
2100 PENNSYLVANIA AVENUE, N.W. |
SUITE 800 |
WASHINGTON, DC 20037 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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726, UNGNAM-RO, SEONGSAN-GU, |
GYEONGSANGNAM-DO |
CHANGWON-SI, KOREA, REPUBLIC OF 642-120 |
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SUGHRUE MION, PLLC |
2100 PENNSYLVANIA AVENUE, N.W. |
SUITE 800 |
WASHINGTON, DC 20037 |
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