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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/25/2008
Application #:
10686384
Filing Dt:
10/14/2003
Publication #:
Pub Dt:
05/06/2004
Inventors:
Masayuki Tobita, Naoyuki Shimoyama, Tsukasa Ishigaki, Hisashi Aoki, Toru Kimura et al
Title:
HEAT CONDUCTING POLYMER MOLD PRODUCTS
Assignment: 1
Reel/Frame:
014619/0775Recorded: 10/14/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Exec Dt:
09/22/2003
Assignee:
SENJYO BLDG., 4-8-16, NIHONBASHI-HONCHO
CHUO-KU, TOKYO 103-8424, JAPAN
Correspondent:
FISH & RICHADSON P.C.
Y. ROCKY TSAO
225 FRANKLIN STREET
BOSTON, MA 02110-2804

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