Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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11313435
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Filing Dt:
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12/19/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Kwun-Yao Ho, Moriss Kung
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Title:
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CHIP PACKAGE AND BUMP CONNECTING STRUCTURE THEREOF
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F, NO. 535, CHUNG-CHENG RD. |
HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN R.O.C. |
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J.C. PATENTS, INC. |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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