Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
06/10/2008
|
Application #:
|
11255710
|
Filing Dt:
|
10/19/2005
|
Publication #:
|
|
Pub Dt:
|
04/19/2007
| | | | |
Inventor:
|
Geng-Shin Shen
|
Title:
|
STACKED-TYPE CHIP PACKAGE STRUCTURE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 1, R&D 1ST RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
|
|
CANON'S COURT, 22 VICTORIA STREET |
HAMILTON HM12, BERMUDA |
|
|
|
J. C. PATENTS, INC. |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
|
|
Search Results as of:
09/23/2024 04:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|