Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/24/2008
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Application #:
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10972746
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Filing Dt:
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10/25/2004
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Leeshawn Luo, Anup Bhalla, Yueh-Se Ho, Sik K. Lui, Mike Chang
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Title:
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INTEGRATED CIRCUIT PACKAGE FOR SEMICONDUCTOR DEVICES HAVING A REDUCED LEADFRAME PAD AND AN INCREASED BONDING AREA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CANON'S COURT 22 VICTORIA STREET |
HAMILTON, BERMUDA HM12 |
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DOUGLAS E. MACKENZIE |
100 CENTURY CENTER CT. |
SUITE 315 |
SAN JOSE, CA 95112 |
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