skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
7405467
Issue Dt:
07/29/2008
Application #:
11233578
Filing Dt:
09/22/2005
Publication #:
20060267187
Pub Dt:
11/30/2006
Inventors:
Chun-Tiao Liu, Da-Jung Chen, Chun-Liang Lin, Jeng-Jen Li, Cheng Chieh Hsu, Chau Chun Wen
Title:
POWER MODULE PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
017030/0252Recorded: 09/22/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIN, CHUN-TIAO
Exec Dt:
09/08/2005
CHEN, DA-JUNG
Exec Dt:
09/07/2005
LIN, CHUN-LIANG
Exec Dt:
09/07/2005
LI, JENG-JEN
Exec Dt:
09/07/2005
HSU, CHENG CHIEH
Exec Dt:
09/07/2005
WEN, CHAU CHUN
Exec Dt:
09/07/2005
Assignee:
CYNTEC CO., LTD
2, R&D 2ND RD., SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, 300, TAIWAN R.O.C.
Correspondent:
THOMAS D. FOSTER, ESQ.
GENUS LAW GROUP
12760 HIGH BLUFF DRIVE
SUITE 300
SAN DIEGO, CALIFORNIA 92130

Search Results as of: 06/21/2024 12:39 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT