Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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11302765
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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06/14/2007
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Inventor:
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Stephen R. Shiffer
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Title:
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HIGH TEMPERATURE PACKAGE FLIP-CHIP BONDING TO CERAMIC
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 COLUMBIA ROAD |
| P.O. BOX 2245, AB-2B |
| MORRISTOWN, NEW JERSEY 07962 |
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| PATENT SERVICES |
| HONEYWELL INTERNATIONAL INC. |
| 101 COLUMBIA ROAD |
| P.O. BOX 2245, AB-2B |
| MORRISTOWN, NJ 07982 |
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