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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7411306
Issue Dt:
08/12/2008
Application #:
11194669
Filing Dt:
08/02/2005
Publication #:
20060030070
Pub Dt:
02/09/2006
Inventors:
Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Jyh-Rong Lin, I-Hsuan Peng, Hui-Mei Wu et al
Title:
PACKAGING STRUCTURE AND METHOD OF AN IMAGE SENSOR MODULE
Assignment: 1
Reel/Frame:
016856/0602Recorded: 08/02/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEU, FANG-JUN
Exec Dt:
07/19/2005
CHEN, SHOU-LUNG
Exec Dt:
07/19/2005
HSIAO, CHING-WEN
Exec Dt:
07/19/2005
YU, SHAN-PU
Exec Dt:
07/19/2005
LIN, JYH-RONG
Exec Dt:
07/19/2005
PENG, I-HSUAN
Exec Dt:
07/19/2005
WU, JIAN-SHU
Exec Dt:
07/19/2005
WU, HUI-MEI
Exec Dt:
07/19/2005
CHIEH, CHIEN-WEI
Exec Dt:
07/19/2005
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD.
CHUTUNG, HSINCHU, TAIWAN R.O.C.
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314

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