Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/16/2008
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Application #:
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11601892
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Filing Dt:
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11/20/2006
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Inventors:
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Charles W.C. Lin, Cheng-Chung Chen
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH BUMPED TERMINAL AND FILLER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3RD FLOOR, 157 LI-TE ROAD |
PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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DAVID M. SIGMOND |
487 BLACKFOOT STREET |
SUPERIOR, COLORADO 80027 |
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