Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/07/2008
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Application #:
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11137820
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Filing Dt:
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05/25/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Inventor:
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Hirofumi Kuroda
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Title:
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RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE THEREWITH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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| ROBERT G. WEILACHER, ESQ. |
| 1230 PEACHTREE STREET, N.E. |
| SUITE 3100, PROMENADE II |
| ATLANTA, GA 30309-3592 |
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