Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11606001
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Filing Dt:
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11/30/2006
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Publication #:
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Pub Dt:
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06/05/2008
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Inventors:
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Feng-Ku Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
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Title:
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HEAT SINK FIXING ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 66, HOU-KANG STREET, SHIH-LIN DIST. |
| TAIPEI, TAIWAN ROC |
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| ROBERT H. BERDO, JR. |
| RABIN & BERDO, PC |
| 1101 14TH STREET, N.W., SUITE 500 |
| WASHINGTON, D.C. 20005 |
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