Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/11/2008
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Application #:
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11073655
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Filing Dt:
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03/08/2005
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Publication #:
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Pub Dt:
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06/29/2006
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Inventors:
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Chen-Chung Du, Jen-Rong Huang, Pang-Ming Chiang, Chih-Yuan Tseng, Muh-Wang Liang et al
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Title:
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WAFER ELECTROPLATING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG-HSING RD., CHUTUNG TOWN |
| HSINCHU HSIEN, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| MORTON J. ROSENBERG, ESQ. |
| 3458 ELLICOTT CENTER DRIVE |
| SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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