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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/18/2008
Application #:
11172689
Filing Dt:
06/30/2005
Publication #:
Pub Dt:
01/12/2006
Inventors:
Dae-Sang Chun, Jae-Hong Kim, Heui-Seog Kim, Jong-Keun Jeon, Wha-Su Sin
Title:
METHOD OF PROCESSING A SEMICONDUCTOR WAFER FOR MANUFACTURE OF SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
016628/0361Recorded: 08/10/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2005
Exec Dt:
06/15/2005
Exec Dt:
06/20/2005
Exec Dt:
06/26/2005
Exec Dt:
06/15/2005
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO (SOUTH), KOREA, REPUBLIC OF
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
210 S.W. MORRISON STREET, SUITE 400
PORTLAND, OREGON 97204

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