Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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11141861
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Filing Dt:
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06/01/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Inventor:
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Christopher P. Schaffer
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Title:
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HIGH POWER MCM PACKAGE WITH IMPROVED PLANARITY AND HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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233 KANSAS STREET |
EL SEGUNDO, CALIFORNIA 90245 |
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OSTROLENK FABER GERB & SOFFEN, LLP |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10036-8403 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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101 N. SEPULVEDA BLVD. |
EL SEGUNDO, CALIFORNIA 90245 |
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VICTORIA FRIEDMAN |
2 NORTH RIVERSIDE PLAZA, SUITE 1500 |
CHICAGO, IL 60606 |
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