Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/02/2008
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Application #:
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11436851
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Filing Dt:
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05/18/2006
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Yong-Chai Kwon, Kang-Wook Lee, Keum-Hee Ma, Seong-II Han
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Title:
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STACKED CHIP PACKAGE USING PHOTOSENSITIVE POLYMER AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| ANTHONY P. ONELLO, JR. |
| ELEVEN BEACON STREET |
| SUITE 605 |
| BOSTON, MASSACHUSETTS 02108 |
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