Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/30/2008
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Application #:
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11092498
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Filing Dt:
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03/29/2005
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Publication #:
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Pub Dt:
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12/22/2005
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Inventor:
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Sang-Yun Lee
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Title:
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WAFER BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1915 NW AMBERGLEN PKWY. |
SUITE 310 |
BEAVERTON, OREGON 97006 |
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ALBERT L. SCHMEISER |
18 E. UNIVERSITY DRIVE |
SUITE 101 |
MESA, AZ 85201 |
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Assignment:
2
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746-8, BANPO-DONG, SOCHO-GU |
SAERONA BUILDING |
SEOUL, KOREA, REPUBLIC OF 137-040 |
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J. ALFRED MURRAY, DAVIS WRIGHT TREMAINE |
1300 SW FIFTH AVENUE, SUITE 2400 |
PORTLAND, OR 97201-5610 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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1915 NW AMBERGLEN PARKWAY SUITE 400 |
BEAVERTON, OREGON 97006 |
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J. ALFRED MURRAY, DAVIS WRIGHT TREMAINE |
1300 SW FIFTH AVENUE, SUITE 2400 |
PORTLAND, OR 97201 |
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