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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/30/2008
Application #:
10590067
Filing Dt:
08/21/2006
Publication #:
Pub Dt:
08/02/2007
Inventors:
Tetsuo Shimomura, Atsushi Kazuno, Kazuyuki Ogawa, Yoshiyukii Nakai, Masahiko Nakamori et al
Title:
POLISHING PAD AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
018229/0445Recorded: 08/21/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Assignee:
17-18, EDOBORI 1-CHOME, NISHI-KU
OSAKA-SHI, OSAKA 550-8661, JAPAN
Correspondent:
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
P.O. BOX 2902
MINNEAPOLIS, MN 55402-0902
Assignment: 2
Reel/Frame:
037996/0954Recorded: 03/16/2016Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/25/2015
Assignee:
451 BELLEVUE ROAD
NEWARK, DELAWARE 19713
Correspondent:
KATHY WERTZ
2040 DOW CENTER
MIDLAND, MI 48674

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