Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/13/2009
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Application #:
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11479740
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Filing Dt:
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06/30/2006
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Publication #:
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Pub Dt:
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01/03/2008
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Inventors:
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Daoqiang Lu, Rajashree Baskaran, Chuan Hu
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Title:
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WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR, & ZAFMAN LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085 |
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