Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11174459
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Filing Dt:
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07/06/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Inventors:
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Osamu Toyoda, Kazunori Inoue, Akira Tokai
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Title:
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MOLDING MATERIAL TRANSFER METHOD AND SUBSTRATE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| 1-20-10, SEKIGUCHI, BUNKYO-KU |
| TOKYO 112-0014, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: H. J. STAAS |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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TRUST AGREEMENT REGARDING PATENT RIGHTS, ETC. DATED JULY 27, 2005 AND MEMORANDUM OF UNDERSTANDING REGARDING TRUST DATED MARCH 28, 2007
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| 2-1, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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| ALEX CHARTOVE |
| MORRISON & FOERSTER LLP |
| 1650 TYSONS BLVD. -SUITE 400 |
| MCLEAN, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8280 |
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| STAAS & HALSEY LLP |
| 1201 NEW YORK AVENUE, N.W. |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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