Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/26/2009
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Application #:
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11707374
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Filing Dt:
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02/17/2007
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Inventors:
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Charles W.C. Lin, Cheng-Chung Chen
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH BUMPED TERMINAL, FILLER AND INSULATIVE BASE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 487 BLACKFOOT STREET |
| SUPERIOR, CO 80027 |
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