Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2009
|
Application #:
|
11775120
|
Filing Dt:
|
07/09/2007
|
|
Publication #:
|
|
Pub Dt:
|
01/17/2008
| | | | |
|
Inventors:
|
Hyun-Soo CHUNG, Seung-Kwan RYU, Ju-Il CHOI, Dong-Ho LEE, Seong-Deok HWANG
|
|
Title:
|
METHOD OF FORMING SEMICONDUCTOR CHIPS, THE SEMICONDUCTOR CHIPS SO FORMED AND CHIP-STACK PACKAGE HAVING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
|
|
|
|
| HOSOON LEE |
| 210 SW MORRISON STREET |
| SUITE 400 |
| PORTLAND, OR 97204 |
|
|
Search Results as of:
06/22/2025 03:16 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
