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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/14/2009
Application #:
12018638
Filing Dt:
01/23/2008
Publication #:
Pub Dt:
07/23/2009
Inventors:
Chin-Hung Liu, Chin-Lung Chen, Ming-Tsung Tung, Wen-Kuo Li
Title:
IC CHIP
Assignment: 1
Reel/Frame:
020405/0715Recorded: 01/23/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/22/2008
Exec Dt:
01/22/2008
Exec Dt:
01/22/2008
Exec Dt:
01/22/2008
Assignee:
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
J.C. PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618

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