Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2009
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Application #:
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11640592
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Filing Dt:
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12/18/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Inventors:
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John W. Hartzell, Harry Garth Walton, Michael James Brownlow
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Title:
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METHOD FOR INTEGRATED MEMS PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA, JAPAN 545-8522 |
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| ERIN HUDJOHN |
| 5750 NW PACIFIC RIM BLVD. |
| CAMAS, WA 98607 |
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