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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	7602046	Issue Dt:	10/13/2009	Application #:	11075323	Filing Dt:	03/07/2005
Publication #:	20050150447	Pub Dt:	07/14/2005
Inventors:	Bruno Ghyselen, Cecile Aulnette, Benedite Osternaud, Takeshi Akatsu, Bruce Faure
Title:	RECYCLING BY MECHANICAL MEANS OF A WAFER COMPRISING A MULTILAYER STRUCTURE AFTER TAKING-OFF A THIN LAYER THEREOF

Assignment: 1

Reel/Frame:

015913/0600

Recorded: 04/18/2005

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

GHYSELEN, BRUNO

Exec Dt:

02/28/2005

AULNETTE, CÉCILE

Exec Dt:

02/28/2005

OSTERNAUD, BÉNÉDICTE

Exec Dt:

02/28/2005

AKATSU, TAKESHI

Exec Dt:

02/22/2005

FAURE, BRUCE

Exec Dt:

02/28/2005

Assignee:

S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES, S.A.

PARC TECHNOLOGIQUE DES FONTAINES

F-38190 BERNIN, FRANCE F38190

Correspondent:

ALLAN A. FANUCCI

1700 K STREET, N.W.

WASHINGTON, DC 20006

Assignment: 2

Reel/Frame:

016429/0299

Recorded: 08/22/2005

Pages: 8

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST NAME OF ASSIGNOR OSTERNAUD FROM "BENEDICTE" TO "BENEDITE" PREVIOUSLY RECORDED ON REEL 015913 FRAME 0600. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.

Assignors:

GHYSELEN, BRUNO

Exec Dt:

02/28/2005