Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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11461587
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Filing Dt:
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08/01/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Inventors:
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Michael T. McClure, Jack Chocola, Kevin K. Lin, George Grama
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Title:
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WAFER LEVEL PACKAGING OF MATERIALS WITH DIFFERENT COEFFICENTS OF THERMAL EXPANSION
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2300 NE BROOKWOOD PARKWAY |
| HILLSBORO, OREGON 97124 |
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| SCHWABE WILLIAMSON & WYATT |
| PACWEST CENTER, SUITE 1900 |
| 1211 SW FIFTH AVENUE |
| PORTLAND, OR 97204 |
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